Tata Electronics has announced seven Memorandums of Understanding (MoUs) at Semicon India 2026, with the five partnerships detailed in the company’s announcements involving Nexperia, Fujifilm, Besi, Semi-Conductor Laboratory (SCL) and Gati Shakti Vishwavidyalaya. The agreements cover multiple parts of the semiconductor value chain, including wafer fabrication, assembly and testing, materials, advanced packaging, chip design, supply-chain localisation and workforce development.
The Nexperia partnership covers front-end wafer fabrication, back-end assembly and test, and technology and ecosystem development. The companies are laying the groundwork to manufacture Nexperia’s MOSFET portfolio at Tata Electronics’ upcoming 300mm semiconductor Fab in Dholera, Gujarat. The agreement also includes assembly and testing of Nexperia’s discrete semiconductor products at Tata Electronics’ packaging facility in Jagiroad, Assam.
The five partnerships collectively extend across Tata Electronics’ planned semiconductor manufacturing and packaging operations. The Dholera Fab is being built with an investment of ₹91,000 crore and is planned to manufacture chips across 28nm to 110nm technology nodes, while the Jagiroad packaging facility involves an investment of $3 billion.
Tata Electronics-Nexperia Partnership Covers Fab And Assembly
Under the Nexperia agreement, the companies will collaborate on manufacturing, technology development, research and semiconductor ecosystem development. Nexperia’s expertise in discrete, power and analogue semiconductors will be combined with Tata Electronics’ manufacturing capabilities.
Nexperia’s products will be manufactured across the two Tata Electronics facilities, with MOSFET production planned for Dholera and discrete semiconductor assembly and testing planned for Jagiroad. The companies also intend to develop cooperation around technology and the broader semiconductor ecosystem.
Nexperia COO Achim Kempe said the partnership extends beyond manufacturing into technology development and ecosystem growth. Tata Electronics CEO and managing director Randhir Thakur said the agreement covers the semiconductor manufacturing value chain and supports the company’s plans for an integrated semiconductor manufacturing ecosystem in India.
Fujifilm To Invest ₹800 Crore In Dholera Semiconductor Materials Plant
Tata Electronics and Fujifilm have signed an MoU focused on developing the semiconductor materials ecosystem around the Dholera Fab. Fujifilm will develop and supply semiconductor materials suited to the requirements of the facility.
The partnership will focus on localising critical raw materials required for semiconductor fabrication and supporting Indian chemical manufacturers with technology, quality assurance and manufacturing process know-how for producing high-purity chemicals.
Fujifilm plans to invest approximately ₹800 crore, or about $83 million, in phases to establish a semiconductor materials plant in the Dholera Special Investment Region. The facility is intended to support the availability and movement of materials for Tata Electronics’ commercial Fab.
Tata Electronics’ Dholera Fab is a 300mm facility planned for semiconductor production across 28nm to 110nm nodes, with applications including automotive, consumer electronics, computing and data storage, wireless communications and AI.
Besi Partnership Targets Advanced Semiconductor Packaging
The MoU with Dutch semiconductor assembly equipment supplier Besi focuses on advanced packaging capabilities at Tata Electronics’ Jagiroad facility in Assam.
The companies will assess opportunities to strengthen the local semiconductor equipment support ecosystem, facilitate technical collaboration and improve equipment readiness for Tata Electronics’ packaging operations. Besi’s advanced packaging equipment and technologies will support the technology readiness of the Jagiroad facility.
The partnership also includes potential engineering capability development, knowledge-sharing, specialised training and employee certification. Tata Electronics and Besi will work towards a shared technology roadmap and processes for advanced packaging. Besi’s portfolio includes die attach, flip-chip bonding, thermo-compression bonding, hybrid bonding and molding technologies.
Tata Electronics And SCL To Collaborate On Semiconductor Indigenisation
The MoU with Semi-Conductor Laboratory (SCL) focuses on semiconductor indigenisation through collaboration in chip design, process technologies, supply-chain localisation and talent development.
The two organisations intend to explore chip design services for government and startup projects and technology-node enablement to broaden access to advanced nodes. The agreement also covers domestic supply-chain development and workforce skilling. The partnership is intended to support applications in aerospace, defence, strategic and emerging technology domains.
SCL is an autonomous body under the Ministry of Electronics and Information Technology and operates a 200mm CMOS fabrication line at the 180nm node, along with a dedicated MEMS line. Its capabilities span design, fabrication, packaging and testing.
Gati Shakti Vishwavidyalaya MoU Focuses On Semiconductor Talent
The fifth detailed partnership is with Gati Shakti Vishwavidyalaya and focuses on skilling and talent development for the semiconductor industry.
The programme will cover semiconductor facility engineering and infrastructure systems, project management, and logistics and supply chain. Tata Electronics, along with its partners L&T EduTech and Jacobs Solutions, will provide subject-matter expertise to the university.
The collaboration will include academic curriculum development, joint certification programmes and industry-oriented skilling initiatives. The programmes are intended to provide students with skills relevant to Fab construction and operations.
Tata Electronics is establishing its commercial semiconductor Fab in Dholera with an investment of $11 billion, according to the Gati Shakti Vishwavidyalaya announcement. The company says the facility will support applications spanning automotive, mobile, IoT, AI, aerospace, defence and other strategic sectors.