New Delhi: Qualcomm Technologies and Tata Electronics have announced a manufacturing tie-up that puts India’s auto tech supply chain story back in the headlines. The plan is to make Qualcomm Automotive Module products in India, aimed at serving both Indian and global automakers, with manufacturing slated to start at Tata Electronics’ upcoming semiconductor assembly and test facility in Jagiroad, Assam.
This is honestly a huge win for the Make in India initiative. Instead of relying totally on other countries for those complex car brains we will now build them locally. These modules are the magic components that power modern digital car screens and smart systems.
What Qualcomm and Tata Electronics agreed to do
Under the collaboration, Tata Electronics will serve as a manufacturing partner for Qualcomm Automotive Modules. Qualcomm says this expands its global network of module manufacturing partners to meet rising demand for modular automotive platforms. The modules will be manufactured in India at Tata Electronics’ OSAT facility in Assam.
Qualcomm’s Nakul Duggal called it “an important milestone” and said, “As the industry accelerates its shift toward integrated, module-based architectures, expanding manufacturing capacity in key regions becomes essential.”
What exactly is being made in Assam
Qualcomm Automotive Modules package Snapdragon Digital Chassis system-on-chips with other system parts into “a single, production-ready module.” The pitch is simpler integration for car makers, faster development timelines, and a path to software-defined vehicles.
Savi Soin, Qualcomm India, said, “Manufacturing in India through Tata Electronics enhances our ability to support both Indian and global OEMs with greater flexibility and supply chain resilience.”
Why this matters for India’s chip story
Tata Electronics says the Jagiroad site is India’s first indigenous OSAT facility, a greenfield project built with an investment of US$3 billion. Tata Electronics CEO Randhir Thakur said, “We are excited to partner with Qualcomm Technologies to manufacture their advanced automotive modules in India.” The facility plans to work on Wire Bond, Flip Chip, and Integrated Systems Packaging.